SAN DIEGO (IndoTelko) — Qualcomm Incorporated announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., has successfully demonstrated Three-Carrier High-Speed Downlink Packet Access (3C-HSDPA) for the first time in a live demonstration.
The demonstration highlights the latest advancements in 3G mobile communications technology and was powered by Qualcomm Technologies’ industry-leading, multi-mode modem technology, specifically, the Qualcomm Gobi 9x25 chipset.
The 3C-HSDPA protocol delivers potential data download speeds of up to 63 Mbps, or 50 percent faster than the current Dual Carrier HSPA+ standard, enabling higher network capacities for operators and faster connections for end users for tasks like Web browsing, email and social networking.
“Qualcomm Technologies continues to enable a better mobile connectivity experience worldwide,” said Serge Willenegger, vice president of product management, Qualcomm Technologies, Inc. “3G networks continue to be the primary broadband mobile internet gateway through most of the world, particularly in emerging regions, and we are pleased to be providing operators and users of those networks with yet another product feature towards a faster and more ubiquitous mobile experiences.”
3C-HSDPA will be commercially available in smartphones and tablets from leading manufacturers worldwide in the second half of this year.(es)